· SiC Power Device Wafer Level Test Set Up (2000V/100A Level)

· Certified as an Excellent Technology-Based Firm (Top Grade: T-3 / NICE Information Service)

· Certified as an Inno-Biz (Technology Innovation-driven SME) 

· Commenced mass production of Si Super Junction MOSFETs 

· Awarded the $1 Million Export Tower (The 59th Trade Day)

· Acquired ISO9001 / ISO14001 Certification (Orion Registrar, Inc.)

·  Developed proximity sensor IC package for SOLUM Co., Ltd.

·  Relocated headquarters and completed semiconductor test line (Bucheon, Sambo Technopark)

·  Launched mass production of Wafer/Final Test (signed supply contract with Samsung Electro-Mechanics for 64CH Switch IC F/T)

·  Expanded packaging business: test equipment set-up, partnership with GoodArk (China) and Microbonding

·  Signed NFC IC agent contract with 3A Logics

·  Certified as an Excellent Technology Evaluation Company (NICE Information Service)

·  Registered patents: frequency control circuit for LED drivers,

semiconductor package and manufacturing method using ultrasonic welding

·  Signed distributor agreement with Japanese test equipment supplier (Spandnix)

·  Completed development and began mass production of LED Driver IC for automotive interior lighting

· Completed development and began mass production of LED Driver IC for lighting Signed distributor agreements with CIS and lens manufacturers (Himax Imaging / Optrontec)

·  Established Corporate Research Center

·  Expanded into Foundry Services & Packaging Solutions (MagnaChip Semiconductor, DB HiTek, JCET, etc.)

·  Established Rootsemicon Co., Ltd. and launched System IC testing & packaging business