rootsemicon

Prober & Handler

● Wafer 테스트 ● Final 테스트

TEL (P8-XL & 12-XL)

Wafer Size: 4~8inch / 4~12inch
Die Size: 350um~76,000um
Resolution: Stage (0.4um)
Z-Stage(2um)
Maximum Speed: Stage (200 mm/s)
Z-Stage(40mm/s)

STI(AT-468)

3D Inspection (Top, Bottom, Inpocket, Post Seal)
Test Site 8ea
Testable Size 2×2~12×12
Input : Bulk
Output : Tape and Reel
UPH: 30K

SRM(Z-248)

3D Inspection (Top, Bottom, Inpocket, Post Seal)
Test Site 8ea
Testable Size 1×0.6~12×12
Input : Bulk
Output : Tape and Reel
UPH: 48K

KC8088

Test Site: ~8 Parallel
Testable Size: 3×3~50×50
Hot Chamber
Index time: 0.43 sec
Tray input Tray out

STI (Hexa-Maxx)

3D Inspection (Top, Bottom, Inpocket,Post Seal)
Input : Tray
Output : Tape and Reel, Tray
UPH: 14K

Main Scope of Test Services

Wafer Level Test (CP / EDS)

ㆍProbe Card Design and Customization
ㆍWafer-Level Electrical Characterization and Yield Analysis
ㆍProvision of Wafer Sort Data (including Yield Map)

Package Level Final Test (FT)

• Digital / Analog / Mixed Signal / Power IC Final Test
• Functional Test, Parametric Test, Burn-in Test
• Handling support by package type (Tray, Tape & Reel, Tube, etc.)

Reliability Test

• Supports various JEDEC standards including HTRB, HTGB, uHAST, PCT, TC, and HTSL
• Provides Pre/Post Test Data Analysis and Failure Analysis (FA) support

Custom Test Solution Development

• Development of Test Programs optimized for customer product characteristics
• Utilizing NI PXI-based test platforms and COTS (Commercial Off-The-Shelf) platforms
• Support for establishing a Turnkey Test Flow

Test Service Capabilities and Development Scope

High-Speed, High-Precision Test Program Development

Secured specialized test know-how for power devices (SiC MOSFET / Diode / IGBT, etc.)

Expertise in optimizing Analog / Mixed Signal IC tests.

High-Reliability Testing Capability for High-Temp / High-Voltage Conditions

Providing feedback based on test data analysis to drive process improvements.

#2720, Sambo Techno Tower, 122, Jomaru-ro 385beon-gil, Wonmi-gu, Bucheon-si, Gyeonggi-do, 14556, Korea
Tel. 070-4349-0077 l Fax. 02-6280-2023
E-mail. rootsemi@rootsemicon.co.kr

Copyright ⓒ 2025 ROOTSEMICON All reserved.

Established	November 12, 1970
Capital	JPY 98 Million
Sales Volume	JPY 1.6 Billion(2016)
HQ Location	Tokorozawa City, Saitama, Japan
C.E.O	Takahiro Seki
Employees	60 (including 4 Chinese engineers and sales)