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Package Service

Package service

Rootsemicon provides one-stop services for Fabless customers, 

covering high-performance and high-reliability package development through to mass production. 

Based on our in-house TEST line and PKG sample fabrication capabilities, 

we offer packaging solutions optimized for a wide range of applications.

We offer a diverse portfolio of packages, including TO, QFN, Modules, and more.

Ensuring Reliable Process Quality (ISO/IATF-Based Quality System)

In-house EDS, FT, and REL Test capabilities (Enabling rapid verification and feedback)

Mass Production Support through a Global OSAT Network

Expertise in specialized package development for power devices like SiC MOSFETs and SiC Diodes.

Dicing Service

  • Compound Semiconductors : Si/SiC/GaN/Glass
  • Wafer 4~12inch
  • MPW Sawing
  • Die Sorting (Recon)
  • Wafer Inspection
  • DI Water Recycling
More

Sample PKG Service

  • Development sample package fabrication (QFN / LGA / QFP)
  • Various types of COB
  • Special sensor package development
  • Open Cavity PKG
  • Ceramic PKG
  • Remarking
  • TAT : Under 1Week
More

QFN / DFN / QFP / BGA / SOP / SOT / TO Packages and more, 
Providing a wide range of one-stop packaging services.

Delivering cost-effective and competitive solutions.



Efficient TAT (Turnaround Time) Management



Providing customized support and advice based on customer requests.




RootSemicon delivers optimal solutions and services for diverse needs, 

freeing customers to concentrate on product design and wafer production.

Size

Package Thickness

Performance

Reliability

High Integration

Cost

Efficient supply chain management

Quick and effective 
decision-making

Cost reduction through process and logistics simplification

Lead time reduction considering customers’ product launch schedules

#2720, Sambo Techno Tower, 122, Jomaru-ro 385beon-gil, Wonmi-gu, Bucheon-si, Gyeonggi-do, 14556, Korea

Tel. 070-4349-0077  l  Fax. 02-6280-2023

E-mail. rootsemi@rootsemicon.co.kr


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